ST62T52CMC datasheet(68/72 Pages) STMICROELECTRONICS

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ST62T52CM-Auto ST62T62CM-Auto

THERMAL CHARACTERISTICS

7.2 SOLDERING INFORMATION

In accordance with the RoHS European directive,

all STMicroelectronics packages have been con-

verted to lead-free technology, named ECO-

PACK

® .

■ ECOPACK

® packages are qualified according

to the JEDEC STD-020B compliant soldering

profile.

■ Detailed information on the STMicroelectronics

ECOPACK

® transition program is available on

www.st.com/stonline/leadfree/,

with

specific

technical application notes covering the main

technical

aspects

lead-free

conversion

(AN2033,

AN2034,

AN2035,

AN2036).

Forward compatibility

ECOPACK

® LQFP packages are fully compatible

with lead (Pb) containing soldering process (see

application note AN2034).

Table 22. Soldering Compatibility (Wave and Reflow Soldering Process)

7.3 OTP/EPROM VERSION ORDERING INFORMATION

Table 23. OTP/EPROM VERSION ORDERING INFORMATION

7.4 IMPORTANT NOTE

For OTP devices, data retention and programmability must be guaranteed by a screening procedure. Re-

fer to Application Note AN886.

Symbol

Parameter

Test Conditions

Value

Unit

Min.

Typ.

Max.

RthJA

Thermal Resistance

SO16

°C/W

Package

Plating Material Devices

Pb Solder Paste

Pb-free Solder Paste

SO16

NiPdAu

Yes

Sales Type

Program

Memory (Bytes)

EEPROM (Bytes)

Temperature Range

Package

ST62E62CF1

1836 EPROM

0 to +70°C

CDIP16W

ST62T62CMA

1836 OTP

-40 to + 85°C

SO16

ST62T62CMC

-40 to + 125°C

ST62T52CMA

1836 OTP

None

-40 to + 85°C

ST62T52CMC

-40 to + 125°C

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