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L6756D Datenblatt(PDF) 34 Page - STMicroelectronics

Teilenummer L6756D
Bauteilbeschribung  2/3/4 phase buck controller for VR10, VR11 and VR11.1 processor applications
PDF  36 Pages
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Hersteller  STMICROELECTRONICS [STMicroelectronics]
Direct Link  http://www.st.com
Logo STMICROELECTRONICS - STMicroelectronics

L6756D Datenblatt(HTML) 34 Page - STMicroelectronics

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Mechanical data and package dimensions
L6756D
34/36
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Mechanical data and package dimensions
In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a lead-free second level interconnect. The category of
second Level Interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK is an ST trademark.
ECOPACK specifications are available at: www.st.com.
Figure 17.
Mechanical data and package dimensions
OUTLINE AND
MECHANICAL DATA
DIM.
mm
inch
MIN.
TYP.
MAX.
MIN.
TYP.
MAX.
A
0.800
0.900
1.000
0.031
0.035
0.039
A1
0.020
0.050
0.0008 0.0019
b
0.180
0.250
0.300
0.007
0.009
0.012
D
5.900
6.000
6.100
0.232
0.236
0.240
D2
3.950
4.100
4.200
0.155
0.161
0.165
E
5.900
6.000
6.100
0.232
0.236
0.240
E2
3.950
4.100
4.200
0.155
0.161
0.165
e
0.500
0.020
L
0.300
0.400
0.500
0.012
0.015
0.018
ddd
0.080
0.003
VFQFPN-40 (6x6x1.0mm)
Very Fine Quad Flat Package No lead
ddd



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