STPS1L30M datasheet(4/5 Pages) STMICROELECTRONICS

4 / 5 page

STPS1L30M

4/5

100

1000

100

V (V)

F=1MHz

osc=30mV

j=25°C

C(pF)

Fig. 9: Junction capacitance versus reverse

voltage applied (typical values).

0.0

0.2

0.4

0.6

0.8

1.0

1.2

1.4

1.6

1.8

2.0

0.00

0.05

0.10

0.15

0.20

0.25

0.30

0.35

0.40

0.45

0.50

(V)

j=25°C

(Maximum values)

j=85°C

(Maximum values)

j=85°C

(Maximum values)

j=85°C

(Typical values)

j=85°C

(Typical values)

(A)

Fig. 10: Forward voltage drop versus forward

current.

100

150

200

250

100

120

140

160

180

200

S(mm²)

(°C/W)

th(j-a)

Fig. 11: Thermal resistance junction to ambient

versus copper surface under tab (epoxy printed

board FR4, Cu = 35µm, typical values).

1.E-02

1.E-01

1.E+00

1.E+01

1.E+02

1.E+03

02468

V (V)

j=150°C

j=125°C

j=25°C

j=100°C

j=75°C

j=50°C

I (mA)

Fig. 7: Reverse leakage current versus reverse

voltage applied (typical values).

1.E-02

1.E-01

1.E+00

1.E+01

1.E+02

1.E+03

100

125

150

Tj(°C)

R=30V

I (mA)

Fig. 8: Reverse leakage current versus junction

temperature (typical values).

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