| Datenblatt-Suchmaschine für elektronische Bauteile |
|
STPS1L30U Datenblatt(PDF) 4 Page - STMicroelectronics |
|
|
|||||||||||||||||||||||||||||
STPS1L30U Datenblatt(HTML) 4 Page - STMicroelectronics |
|
4 / 5 page ![]() 01 2 3 45 0 20 40 60 80 100 120 140 S(Cu) (cm²) Rth(j-a) (°C/W) Fig. 8-2: Thermal resistance junction to ambient versus copper surface under each lead (Epoxy printed circuit board FR4, copper thickness: 35 µm) (SMA). 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 0 20 40 60 80 100 120 S(Cu) (cm²) Rth(j-a) (°C/W) Fig. 8-1: Thermal resistance junction to ambient versus copper surface under each lead (Epoxy printed circuit board FR4, copper thickness: 35 µm) (SMB). PACKAGE MECHANICAL DATA SMA FOOT PRINT DIMENSIONS (in millimeters) 2.40 1.65 1.45 1.45 E C L E1 D A1 A2 b REF. DIMENSIONS Millimeters Inches Min. Max. Min. Max. A1 1.90 2.70 0.075 0.106 A2 0.05 0.20 0.002 0.008 b 1.25 1.65 0.049 0.065 c 0.15 0.41 0.006 0.016 E 4.80 5.60 0.189 0.220 E1 3.95 4.60 0.156 0.181 D 2.25 2.95 0.089 0.116 L 0.75 1.60 0.030 0.063 STPS1L30A/U 4/5 |
|
|
Link URL |
| War ALLDATASHEET hilfreich? [ DONATE ] |
Über Alldatasheet | Werbung | Kontakt | Privatsphäre und Datenschutz | Link zum Datenblatt | Linktausch | Hersteller All Rights Reserved©Alldatasheet.com |
| Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
|
Family Site : ic2ic.com |
icmetro.com |