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L6668

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Package information

age. This package has a Lead-free second level interconnect. The category of second level Interconnect

is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97.

The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK

is an STMicroelectronics trademark.

ECOPACK specifications are available at: www.st.com.

Figure 47. SO16 (Narrow) Mechanical Data & Package Dimensions

OUTLINE AND

MECHANICAL DATA

DIM.

mm

inch

MIN.

TYP.

MAX.

MIN.

TYP.

MAX.

A

1.75

0.069

a1

0.1

0.25

0.004

0.009

a2

1.6

0.063

b

0.35

0.46

0.014

0.018

b1

0.19

0.25

0.007

0.010

C

0.5

0.020

c1

45

°

(typ.)

9.8

10

0.386

0.394

E

5.8

6.2

0.228

0.244

e

1.27

0.050

e3

8.89

0.350

3.8

4.0

0.150

0.157

G

4.60

5.30

0.181

0.208

L

0.4

1.27

0.150

0.050

M

0.62

0.024

S8

° (max.)

(1) "D" and "F" do not include mold flash or protrusions - Mold

flash or protrusions shall not exceed 0.15mm (.006inc.)

SO16 (Narrow)

0016020 D