THE CONNOR-WINFIELD CORP.

2111 COMPREHENSIVE DRIVE.

AURORA, IL 60505.

FAX

(630) 851-5040.

PHONE (630) 851-4722.

PRODUCT

DA T A

SHEET

Specifications subject to change without notice.

DATASHEET #:

REV:

DATE:

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OF

Copyright 2001 Connor-Winfield all rights reserved.

a

CRYSTAL CONTROLLED OSCILLATORS

2

2

Cx012

04

11/28/06

90%

50%

10%

.330 max

(8.382mm)

.330 max

(8.382mm)

.830

(21.08mm)

.565

(14.35mm)

Pin

Function

1

N/C

7

Ground (Case)

8

Output

14

Vcc

ENVIRONMENTAL CHARACTERISTICS

Temperature Cycle: Per MIL-STD-883, Method 1010, Condition B. -55°C to 125°C, 20 cycles,10 minute dwell, 1m inute

transition.

SOLDERING

Pad Solderability: Per MIL-STD-883, Method 200. 8 hour steam age prior to 254°C ±5°C Solder pot dip, 95% Coverage.

Solder Reflow: The component solder internal to this device has a melt ing point of 221°C, the peak temperature inside the

device should be less than or equal to 220°C for a maximum of 10 seconds.

MECHANICAL CHARACTERISTICS

Vibration: Per MIL-STD-202, Method 204, Condition A. 10G’s peak, 10Hz to 500Hz, 15mi nute cycles 12 times each

perpendicular axis.

Shock: Per MIL-STD-202, Method 213, Condition D. 500G’s, 1ms, half sine, 3 shocks per direction.

Moisture Resistance: Per MIL-STD-202, Method 106. 95% RH @ 65°C, 10 cycles 10°C to 65°C.

25°C

183°C

360 Sec. Max.

60-120s

Max.

60-150s Max.

Time

Temperature

225°C

0

tp

Ramp-Down Rate

6°C/second max.

10-30s

Ramp-Up Rate

3°C/second max.

from 150°C to 225°C.

Dimensional Tolerance:

±.005 (.127mm)

Solder Profile

Test Circuit

Output Waveform

Suggested Pad Layout

Keep Out Area

Package Outline

Pin Connections