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Datenblatt-Suchmaschine für elektronische Bauteile |
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Datenblatt-Suchmaschine für elektronische Bauteile |
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XC6416 Datenblatt(PDF) 29 Page - Torex Semiconductor |
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XC6416 Datenblatt(HTML) 29 Page - Torex Semiconductor |
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29 / 30 page  29/30 XC6416 Series Pd vs. Ta 0 200 400 600 800 1000 1200 25 45 65 85 105 125 Ambient Temperature Ta（℃） ● USP-6C Power Dissipation Power dissipation data for the USP-6C is shown in this page. The value of power dissipation varies with the mount board conditions. Please use this data as one of reference data taken in the described condition. 1. Measurement Condition (Reference data) Condition: Mount on a board Ambient: Natural convection Soldering: Lead (Pb) free Board: Dimensions 40 x 40 mm (1600 mm 2 in one side) Copper (Cu) traces occupy 50% of the board area In top and back faces Package heat-sink is tied to the copper traces Material: Glass Epoxy (FR-4) Thickness: 1.6 mm Through-hole: 4 x 0.8 Diameter Evaluation Board (Unit: mm) 2. Power Dissipation vs. Operating temperature Board Mount (Tj max = 125℃) Ambient Temperature（℃） Power Dissipation Pd（mW） Thermal Resistance (℃/W) 25 1000 85 400 100 ■PACKAGING INFORMATION (Continued) |
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