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3724MPFE Datenblatt(PDF) 13 Page - Linear Technology |
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3724MPFE Datenblatt(HTML) 13 Page - Linear Technology |
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13 / 24 page ![]() LT3724 13 3724fc APPLICATIONS INFORMATION For maximum efficiency, minimize RDS(ON) and CRSS. Low RDS(ON) minimizes conduction losses while low CRSS minimizes transition losses. The problem is that RDS(ON) is inversely related to CRSS. Balancing the transition losses with the conduction losses is a good idea in sizing the MOSFET. Select the MOSFET to balance the two losses. Calculate the maximum conduction losses of the MOSFET: PCOND =(IOUT(MAX)) 2 VOUT VIN (RDS(ON)) Note that RDS(ON) has a large positive temperature depen- dence. The MOSFET manufacturer’s data sheet contains a curve, RDS(ON) vs Temperature. Calculate the maximum transition losses: PTRAN = (k)(VIN)2 (IOUT(MAX))(CRSS)(fSW) where k is a constant inversely related to the gate driver current, approximated by k = 2 for LT3724 applications. The total maximum power dissipation of the MOSFET is the sum of these two loss terms: PFET(TOTAL) = PCOND + PTRAN To achieve high supply efficiency, keep the PFET(TOTAL) to less than 3% of the total output power. Also, complete a thermal analysis to ensure that the MOSFET junction temperature is not exceeded. TJ = TA + PFET(TOTAL) • θJA where θJA is the package thermal resistance and TA is the ambienttemperature.KeepthecalculatedTJbelowthemaxi- mum specified junction temperature, typically 150°C. Note that when VIN is high, the transition losses may dominate. A MOSFET with higher RDS(ON) and lower CRSS may provide higher efficiency. MOSFETs with higher volt- age VDSS specification usually have higher RDS(ON) and lower CRSS. Choose the MOSFET VDSS specification to exceed the maximum voltage across the drain to the source of the MOSFET, which is VIN(MAX) plus any additional ringing on the switch node. Ringing on the switch node can be greatly reduced with good PCB layout and, if necessary, an RC snubber. The internal VCC regulator operating range limits the maxi- mum total MOSFET gate charge, QG, to 90nC. The QG vs VGS specification is typically provided in the MOSFET data sheet. Use QG at VGS of 8V. If VCC is back driven from an external supply, the MOSFET drive current is not sourced from the internal regulator of the LT3724 and the QG of the MOSFET is not limited by the IC. However, note that the MOSFET drive current is supplied by the internal regulator when the external supply back driving VCC is not available such as during startup or short-circuit. The manufacturer’s maximum continuous drain current specification should exceed the peak switch current, IOUT(MAX) + ΔIL/2. During the supply startup, the gate drive levels are set by the VCC voltage regulator, which is approximately 8V. Once the supply is up and running, the VCC can be back driven by an auxiliary supply such as VOUT. It is important not to exceed the manufacturer’s maximum VGS specification. A standard level threshold MOSFET typically has a VGS maximum of 20V. Step-Down Converter: Rectifier Selection The rectifier diode (D1 on the Functional Diagram) in a buck converter generates a current path for the inductor current when the main power switch is turned off. The rectifier is selected based upon the forward voltage, re- verse voltage and maximum current. A Schottky diode is recommended. Its low forward voltage yields the lowest power loss and highest efficiency. The maximum reverse voltage that the diode will see is VIN(MAX). In continuous mode operation, the average diode cur- rent is calculated at maximum output load current and maximum VIN: IDIODE(AVG) =IOUT(MAX) VIN(MAX) VOUT VIN(MAX) To improve efficiency and to provide adequate margin for short-circuit operation, a diode rated at 1.5 to 2 times the maximum average diode current, IDIODE(AVG), is recom- mended. |
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