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KH231AM Datenblatt(PDF) 4 Page - Cadeka Microcircuits LLC. |
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KH231AM Datenblatt(HTML) 4 Page - Cadeka Microcircuits LLC. |
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4 / 6 page ![]() DATA SHEET KH231 4 REV. 1A January 2004 Operation The KH231 Buffer/Amplifier is based on the current feed- back op amp topology, a design that uses current feed- back instead of the usual voltage feedback. The use of the KH231 is basically the same as that of the conventional op amp (see Figures 1 and 2). Since the device is designed specifically for low gain applications, the best performance is obtained when the circuit is used at gains between ±1 and ±5. Additionally, performance is optimum when a 250 Ω feedback resistor is used. Figure 1: Recommended non-inverting gain circuit Figure 2: Recommended inverting gain circuit Layout Considerations To assure optimum performance the user should follow good layout practices which minimize the unwanted coupling of signals between nodes. During initial bread- boarding of the circuit use direct point to point wiring, keeping the lead lengths to less than 0.25”. The use of solid, unbroken ground plane is helpful. Avoid wire-wrap type pc boards and methods. Sockets with small, short pin receptacles may be used with minimal performance degradation although their use is not recommended. During pc board layout keep all traces short and direct The resistive body of Rg should be as close as possible to pin 5 to minimize capacitance at that point. For the same reason, remove ground plane from the vicinity of pins 5 and 6. In other areas, use as much ground plane as possible on one side of the board. It is especially important to provide a ground return path for current from the load resistor to the power supply bypass capacitors. Ceramic capacitors of 0.01 to 0.1 µf (with short leads) should be less than 0.15 inches from pins 1 and 9. Larger tantalum capacitors should be placed within one inch of these pins. VCC connections to pins 10 and 12 can be made directly from pins 9 and 1, but better supply rejection and settling time are obtained if they are separately bypassed as in figures 1 and 2. To prevent signal distortion caused by reflections from impedance mismatches, use terminated microstrip or coaxial cable when the signal must traverse more than a few inches. Since the pc board forms such an important part of the circuit, much time can be saved if prototype boards of any high frequency sections are built and tested early in the design phase. Evaluation boards designed for either inverting or non-inverting gains are available. Distortion and Noise The graphs of intercept point, I2 and I3, versus frequency on the preceding page make it easy to predict the distortion at any frequency given the output voltage of the KH231. First, convert the output voltage (Vo) to Vrms = (Vpp/2√2) and then to P = [(10log10(20Vrms 2)] to get the power output in dBm. At the frequency of interest, its 2nd harmonic will be S2 = (I2-P)dB below the level of P. Its third harmonic will be S3 = 2(I3- P)dB below P, as will the two-tone third order intermodulation products. These approximations are useful for P < -1dB compression levels. Approximate noise figure can be determined for the KH231 using the equivalent input noise graph on the preceding page. The following equation can be used to determine noise figure (F) in dB. Where Vn is the rms noise voltage and in is the rms noise current. Beyond the breakpoint of the curves (i.e., where they are flat), broadband noise figure equals spot noise fig- ure, so ∆f should equal one (1) and V n and in should be read directly off the graph. Below the breakpoint, the noise must be integrated and ∆f set to the appropriate bandwidth. 33 Ω +15V 0.1 3.9 .01 Capactance in µF 1 12 5 3,7 RL 100 Ω 10 11 33 Ω .01 0.1 3.9 -15V 9 + - KH231 Vo Rf = 250Ω 6 Rg Vin Ri 49.9 Ω A R R v f g = 1+ 250 Ω 33 Ω +15V 0.1 3.9 .01 Capactance in µF 1 12 5 3,7 RL 100 Ω 10 11 33 Ω .01 0.1 3.9 -15V 9 + - KH231 Vo Rf = 250Ω For Zin = 50Ω, select Rg || Ri = 50Ω 6 100 Ω Vin Ri 250 Ω Rg A R R v f g = − F 10log 1 V iR A 4kTR f n 2 n 2 f 2 v 2 s =+ + ∆ |
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