| Datenblatt-Suchmaschine für elektronische Bauteile |
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AP89021 Datenblatt(PDF) 18 Page - Aplus Intergrated Circuits |
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AP89021 Datenblatt(HTML) 18 Page - Aplus Intergrated Circuits |
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18 / 18 page ![]() Integrated Circuits Inc. aP89021/010 Ver 2.2 May 31, 2007 18 6. Bonding Diagram (aP89021) Bonding Diagram (aP89010) Note: Substrate should be connected to Vss. Bonding pad size: 80um x 90um |
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