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SDM119N-R30MF Datenblatt(PDF) 5 Page - Superworld Electronics

Teilenummer SDM119N-R30MF
Bauteilbeschribung  MOLDING TYPE DIP INDUCTORS
PDF  7 Pages
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Hersteller  SUPERWORLD [Superworld Electronics]
Direct Link  http://www.superworld.com.sg
Logo SUPERWORLD - Superworld Electronics

SDM119N-R30MF Datenblatt(HTML) 5 Page - Superworld Electronics

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SUPERWORLD ELECTRONICS (S) PTE LTD
SDM119N SERIES
NOTE : Specifications subject to change without notice. Please check our website for latest information.
PG. 5
18.04.2008
PERFORMANCE
Refer to standard electrical characteristics list
should be covered with solder.
More than 90% of the terminal electrode
Preheating
60
seconds
1. Appearance : No significant abnormality
2. Inductance change : Within ±3%
Preheating
60
seconds
No disconnection or short circuit.
2. Inductance : Within ±3% of initial value.
1. Appearance : No damage
No disconnection or short circuit.
2. Inductance : Within ±5% of initial value.
1. Appearance : No damage
Reliability Test
Humidity Resistance
High Temperature
Life Test
Life Test
Low Temperature
Thermal Shock
Solder Heat Resistance
150°C
260°C
150°C
245°C
Inductance
Electrical Characteristics Test
DCR
Heat Rated Current (Irms)
Solderability Test
Mechanical Performance Test
Saturation Current (Isat)
9. RELIABILITY AND TEST CONDITION :
ITEM
Time : 500±12 hours
Applied Current : Rated Curent
Humidity : 90% to 95%
Temperature : 40±5°C
Temperature : 85±5°C
Time : 500±12 hours
Temperature (°C)
Conditions of 1 cycle.
Temperature : -40±5°C
Time : 500±12 hours
Room Temperature
Room Temperature
85±3
-25±3
Recovery: 4 to 24hrs of recovery under the standard
2
Total : 5 cycles
4
3
Step
1
Within 3
Within 3
30±3
Times (min.)
30±3
Preheat : 150°C, 60sec.
Solder : Sn99.95-Cu0.05
Solder Temperature : 260±5°C
Flux : rosin
Dip Time : 10±0.5sec.
10±0.5
seconds
Dipping
cooling
Natural
4±1
seconds
Dipping
cooling
Natural
HP-4192A, HP4284A, CH1320
TEST CONDITION
Isat(A) will cause Lo to drop approximately 25%
Agilent 33420A
Irms(A) will cause an temp rise < 40°C typ.
solder bath at 245±5°C for 5 seconds
After fluxing, component shall be dipped in a melted
condition after the removal from test chamber
condition after the removal from test chamber
Recovery: 4 to 24hrs of recovery under the standard
condition after the removal from test chamber
Recovery: 4 to 24hrs of recovery under the standard
condition after the removal from test chamber
Recovery: 4 to 24hrs of recovery under the standard
MOLDING TYPE DIP INDUCTORS



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