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www.asb.co.kr

February 2008

Low Noise & High OIP3

Medium Power Amplifier Module

Specifications

Parameter

Unit

Min

Typ

Max

Frequency Range

MHz

2010

2025

Gain

dB

32

33

Gain Flatness

dB

± 0.3

± 0.5

Noise Figure

dB

2.0

2.1

Output IP3

(1)

dBm

44

47

S11 / S22

(2)

dB

-18 / -10

Output P1dB

dBm

28

29

Switching Time

(3)

µsec

-

1

Supply Current

mA

460

500

Supply Voltage

V

5

Impedance

Ω

50

Max. RF Input Power

dBm

C.W 23 ~ 25 (before fail)

Package Type & Size

mm

Surface Mount Type, 13Wx13Lx3.8H

Operating temperature is -40

°C to +85°C.

1) OIP3 is measured with two tones at an output power of 15 dBm / tone separated by 1 MHz.

2) S11/S22 (max) is the worst value within the frequency band.

Pin Number

Function

3

RF In

8

RF Out

10

+Vcc

Others

Ground

Features

Description

·

= 32.7 dB @ 2025 MHz

·

NF of 2.0 dB over Frequency

·

Unconditionally Stable

·

Single 5V Supply

·

High OIP3 @ Low Current

Website: www.asb.co.kr

E-mail: sales@asb.co.kr

Tel: (82) 42-528-7223

Fax: (82) 42-528-7222

ASB Inc., 4th Fl. Venture Town

Bldg., 367-17 Goijeong-Dong,

Seo-Gu, Daejon 302-716, Korea

More Information

2-stage Single Type

Typ. @ T = 25

Specifications (in Production)

APM2017-P29

ASB Inc.

Solder Stencil Area

Ø0.3 plated thru holes to ground plane

plerow

(Top View)

(Bottom View)

(Side View)

2 x Ø2.0 plated thru holes to screw on heat sinker

(Recommended Footprint)

Outline Drawing (Unit: mm)

Note: 1. The number and size of ground via holes in

a circuit board is critical for thermal RF

grounding considerations.

2. We recommend that the ground via holes be

placed on the bottom of all ground pins for

better RF and thermal performance, as

shown in the drawing at the left side.

amplifier mini-module for such application band in

SMD package with the output P1dB of 29 dBm. It is

compactly designed for low current consumption and

high OIP3. Integrating all the components for biasing

and matching within the module enhances production

yield and throughput as well. It passes through the

stringent DC, RF, and reliability tests. Not sample test

but 100% quality control test is made before packing.