T-Max

TM

TO-264

N-Channel FREDFET

Absolute Maximum Ratings

Thermal and Mechanical Characteristics

G

D

S

Single die FREDFET

Unit

A

V

mJ

A

Unit

W

°C/W

°C

oz

g

in·lbf

N·m

Ratings

70

44

245

±30

1845

33

Min

Typ

Max

1135

0.11

0.11

-55

150

300

0.22

6.2

10

1.1

Parameter

Continuous Drain Current @ T

C

= 25°C

Continuous Drain Current @ T

C

= 100°C

Gate-Source Voltage

Avalanche Current, Repetitive or Non-Repetitive

Characteristic

Total Power Dissipation @ T

C

= 25°C

Junction to Case Thermal Resistance

Case to Sink Thermal Resistance, Flat, Greased Surface

Operating and Storage Junction Temperature Range

Soldering Temperature for 10 Seconds (1.6mm from case)

Package Weight

Mounting Torque ( TO-264 Package), 4-40 or M3 screw

Symbol

I

D

I

DM

V

GS

E

AS

I

AR

Symbol

P

D

T

J

,T

STG

T

L

W

T

Torque

TYPICAL APPLICATIONS

• ZVS phase shifted and other full bridge

• Half bridge

• PFC and other boost converter

• Buck converter

• Single and two switch forward

• Flyback

FEATURES

• Fast switching with low EMI

• Low trr for high reliability

• Ultra low Crss for improved noise immunity

• Low gate charge

• Avalanche energy rated

• RoHS compliant

APT66F60B2

APT66F60L

600V, 70A, 0.09

Ω Max, trr ≤ 310ns

APT66F60B2

APT66F60L

A proprietary planar stripe design yields excellent reliability and manufacturability. Low

tance. The intrinsic gate resistance and capacitance of the poly-silicon gate structure

help control slew rates during switching, resulting in low EMI and reliable paralleling,

even when switching at very high frequency. Reliability in flyback, boost, forward, and

other circuits is enhanced by the high avalanche energy capability.

MicrosemiWebsite-http://www.microsemi.com