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AS111 RAD-TOL

AustinSemiconductor,Inc.reservestherighttochangeproductsorspecificationswithoutnotice.

18

AS111 RAD-TOL

Rev. 1.1 06/05

Austin Semiconductor, Inc.

PRELIMINARY SPECIFICATION

ASI Case (Package Designator CP10)

SMD 5962-00524, Case Outline H

MECHANICAL DEFINITIONS*

*All measurements are in inches.

MIL-STD-1835 outline drawing GDFP1-F10

A

C

Q

L

L

D

e

E

A

C

D

E

e

Q

L

Min

Max

.004

.009

.235

.260

.050 BSC

.250

.370

.026

.045

.226

.251

.045

.085

B

B

.010

.022

PIN 1

Notes:

1. Lead Finish: Solder dipped with Sn 60 or Sn63 solder conforming to MIL-PRF-38535 to a min thickness

of 200 micro-inches. Solder may be applied over lead base metal or Sn plate. Max limit may be increased by

.003 inches after lead finish applied.

2. Lead 1 identification shall be:

a) A notch or other mark within this area.

b) a TAB on lead 1, either side.

1

5

6

10