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MA4FCP200 Datenblatt(PDF) 1 Page - M/A-COM Technology Solutions, Inc.

Teilenummer MA4FCP200
Bauteilbeschribung  Flip Chip PIN Diode
PDF  6 Pages
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Hersteller  MA-COM [M/A-COM Technology Solutions, Inc.]
Direct Link  http://www.macomtech.com
Logo MA-COM - M/A-COM Technology Solutions, Inc.

MA4FCP200 Datenblatt(HTML) 1 Page - M/A-COM Technology Solutions, Inc.

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MA4FCP200
ADVANCED:
Data Sheets contain information regarding a product M/A-COM Technology Solutions
is considering for development. Performance is based on target specifications, simulated results,
and/or prototype measurements. Commitment to develop is not guaranteed.
PRELIMINARY:
Data Sheets contain information regarding a product M/A-COM Technology
Solutions has under development. Performance is based on engineering tests. Specifications are
typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available.
Commitment to produce in volume is not guaranteed.
• North America Tel: 800.366.2266 • Europe Tel: +353.21.244.6400
• India Tel: +91.80.43537383
• China Tel: +86.21.2407.1588
Visit www.macomtech.com for additional data sheets and product information.
M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make
changes to the product(s) or information contained herein without notice.
1
Flip Chip PIN Diode
Rev. V3
Features
♦Low Series Resistance
♦Low Capacitance
♦Fast Switching Speed
♦Silicon Nitride Passivation
♦Polymer Scratch Protection
♦RoHS Compliant
Description
M/A-COM Technology Solutions MA4FCP200 is a
silicon flip chip PIN diode fabricated using a patented
HMIC process which provides for repeatable electrical
characteristics. This diode is fabricated on epitaxial
wafers using a process designed for extremely low
parasitics. The diode is fully passivated with silicon
nitride to minimize leakage current. The chip also has
an additional polymer layer for impact and scratch
protection to
prevent damage to the active area
during handling.
Applications
The small outline and low 0.05pS RC product, make
the device useful in multi-throw switches and switched
phase shifter circuits requiring <20nS switching
speeds at operating frequencies up to 18GHz.
Absolute Maximum Ratings
1
TAMB = +25°C (unless otherwise specified)
1. Exceeding any of these limits may cause permanent
damage to the chip.
Backside metal contacts: 0.1μM thick gold.
Yellow hatched areas indicate backside, mounting,
ohmic, gold contacts.
Parameter
Absolute Maximum
Forward Current
100mA
Reverse Voltage
- 70V
Operating Temperature
- 55°C to + 125°C
Storage Temperature
- 55°C to + 150°C
Dissipated Power
100mW
Mounting Temperature
+300°C for 10 seconds
1264 Outline
Dim.
Inches
Millimeters
Min.
Max.
Min.
Max.
A
0.014
0.015
0.356
0.381
B
0.008
0.009
0.203
0.229
C
0.004
0.005
0.102
0.127
D
0.003
0.004
0.076
0.102
E
0.002
0.003
0.175
0.225
F
0.008
0.010
0.203
0.254
G
0.004
0.006
0.102
0.152


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