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MA4FCP200 Datenblatt(PDF) 1 Page - M/A-COM Technology Solutions, Inc. |
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MA4FCP200 Datenblatt(HTML) 1 Page - M/A-COM Technology Solutions, Inc. |
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1 / 6 page ![]() MA4FCP200 ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions is considering for development. Performance is based on target specifications, simulated results, and/or prototype measurements. Commitment to develop is not guaranteed. PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology Solutions has under development. Performance is based on engineering tests. Specifications are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. Commitment to produce in volume is not guaranteed. • North America Tel: 800.366.2266 • Europe Tel: +353.21.244.6400 • India Tel: +91.80.43537383 • China Tel: +86.21.2407.1588 Visit www.macomtech.com for additional data sheets and product information. M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. 1 Flip Chip PIN Diode Rev. V3 Features ♦Low Series Resistance ♦Low Capacitance ♦Fast Switching Speed ♦Silicon Nitride Passivation ♦Polymer Scratch Protection ♦RoHS Compliant Description M/A-COM Technology Solutions MA4FCP200 is a silicon flip chip PIN diode fabricated using a patented HMIC process which provides for repeatable electrical characteristics. This diode is fabricated on epitaxial wafers using a process designed for extremely low parasitics. The diode is fully passivated with silicon nitride to minimize leakage current. The chip also has an additional polymer layer for impact and scratch protection to prevent damage to the active area during handling. Applications The small outline and low 0.05pS RC product, make the device useful in multi-throw switches and switched phase shifter circuits requiring <20nS switching speeds at operating frequencies up to 18GHz. Absolute Maximum Ratings 1 TAMB = +25°C (unless otherwise specified) 1. Exceeding any of these limits may cause permanent damage to the chip. • Backside metal contacts: 0.1μM thick gold. • Yellow hatched areas indicate backside, mounting, ohmic, gold contacts. Parameter Absolute Maximum Forward Current 100mA Reverse Voltage - 70V Operating Temperature - 55°C to + 125°C Storage Temperature - 55°C to + 150°C Dissipated Power 100mW Mounting Temperature +300°C for 10 seconds 1264 Outline Dim. Inches Millimeters Min. Max. Min. Max. A 0.014 0.015 0.356 0.381 B 0.008 0.009 0.203 0.229 C 0.004 0.005 0.102 0.127 D 0.003 0.004 0.076 0.102 E 0.002 0.003 0.175 0.225 F 0.008 0.010 0.203 0.254 G 0.004 0.006 0.102 0.152 |
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