• North America Tel: 800.366.2266 / Fax: 978.366.2266

• Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300

• Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298

Visit www.macomtech.com for additional data sheets and product information.

M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make

changes to the product(s) or information contained herein without notice.

4

GaAs DPDT Switch

DC - 2.0 GHz

Rev. V3

MASW2040

ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions

is considering for development. Performance is based on target specifications, simulated results,

and/or prototype measurements. Commitment to develop is not guaranteed.

PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology

Solutions has under development. Performance is based on engineering tests. Specifications are

typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available.

Commitment to produce in volume is not guaranteed.

Handling Precautions

Permanent damage to the MASW2040 may occur

if the following precautions are not adhered to:

A. Cleanliness - The MASW2040 should be

handled in a clean environment.

DO NOT

attempt to clean unit after the MASW2040 is

installed.

B. Static Sensitivity - All chip handling equipment

and personnel should be DC grounded.

C. Transient - Avoid instrument and power supply

transients

while

bias

is

applied

to

the

MASW2040.

Use shielded signal and bias

cables to minimize inductive pick-up.

D. Bias - Apply Voltage to either control port A or

B only when the other is grounded.

Neither

port should be allowed to “float.”

E. General Handling - It is recommended that the

MASW2040 chip be handled along the long

side of the die with a sharp pair of bent

tweezers.

DO NOT touch the surface of the

chip with fingers or tweezers.

Mounting

The MASW2040 is back-metallized with Pd/Ni/Au

(100/1,000/10,000Å) metallization.

It can be die-

mounted with AuSn eutectic performs or with

thermally conductive epoxy. The package surface

should be clean and flat before attachment.

Eutectic Die Attach:

A. A 80/20 gold/tin preform is recommended with

a work surface temperature of approximately

255°C and a tool temperature of 265°C. When

not 90/10 nitrogen/hydrogen gas is applied,

tool tip temperature should be approximately

290°C.

B. DO

NOT

expose

the

MASW2040

to

a

temperature greater than 320°C for more than

20 seconds.

No more than 3 seconds for

scrubbing should be required for attachment.

Epoxy Die Attach:

A. Apply a minimum amount of epoxy and place

the MASW2040 into position. A thin epoxy fillet

should be visible around the perimeter of the

chip.

B. Cure epoxy per manufacturer’s recommended

schedule.

C. Electrically conductive epoxy may be used by

is not required.

Wire Bonding

A. Ball or wedge with 1.0 mil diameter pure gold

wire. Thermosonic wirebonding with a nominal

stage temperature of 150°C and a ball bonding

force of 40 to 50 grams or wedge bonding force

o1 18 to 22 grams is recommended. Ultrasonic

energy and time should be adjusted to the

minimum levels achieve reliable wirebonds.

B. Wirebonds should be started on the chip and

terminated on the package.

GND bonds

should be as short as possible; at least three

and no more than four bond wires from ground

pads to package are recommended.