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STM8L151C4 Datenblatt(PDF) 95 Page - STMicroelectronics

Teilenummer STM8L151C4
Bauteilbeschribung  8-bit ultralow power MCU, up to 32 KB Flash, 1 KB Data EEPROM RTC, LCD, timers, USART, I2C, SPI, ADC, DAC, comparators
PDF  101 Pages
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Hersteller  STMICROELECTRONICS [STMicroelectronics]
Direct Link  http://www.st.com
Logo STMICROELECTRONICS - STMicroelectronics

STM8L151C4 Datenblatt(HTML) 95 Page - STMicroelectronics

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STM8L151xx, STM8L152xx
Package characteristics
Doc ID 15962 Rev 2
95/101
Figure 23.
WFQFPN32 – 32-lead very very thin fine pitch quad flat no-lead package
outline (5 x 5)
1.
The exposed pad must be soldered to the PCB. It is recommended to connect it to VSS.
Seating plane
ddd
C
C
A3
A1
A
D
e
9
16
17
24
32
Pin # 1 ID
R = 0.30
8
E
L
L
D2
1
b
E2
A0A3_ME
Bottom view
Table 54.
WFQFPN32 – 32-lead very very thin fine pitch quad flat no-lead package (5 x 5),
package mechanical data(1)
Dim.
mm
inches(2)
Min
Typ
Max
Min
Typ
Max
A(1)
0.70
0.75
0.80
0.0276
0.0295
0.0315
A1
0
0.02
0.05
0.0008
0.0020
A3
0.20
0.0079
b
0.18
0.25
0.30
0.0071
0.0098
0.0118
D
4.85
5.00
5.15
0.1909
0.1969
0.2028
D2
3.20
3.45
3.70
0.1260
0.1358
0.1457
E
4.85
5.00
5.15
0.1909
0.1969
0.2028
E2
3.20
3.45
3.70
0.1260
0.1358
0.1457
e
0.50
0.0197
L
0.30
0.40
0.50
0.0118
0.0157
0.0197
ddd
0.08
0.0031
Number of pins
N32
1.
Thickness valid for the WFQFPN32 package in the sampling phase. In the production phase, the UFQFPN32 package will
be used with a thickness equal to 0.6 mm.
2.
Values in inches are converted from mm and rounded to 4 decimal digits.



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