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MCP3002-I/MS Datenblatt(PDF) 23 Page - Microchip Technology |
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MCP3002-I/MS Datenblatt(HTML) 23 Page - Microchip Technology |
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23 / 34 page ![]() © 2008 Microchip Technology Inc. DS21294D-page 23 MCP3002 7.0 PACKAGING INFORMATION 7.1 Package Marking Information Legend: XX...X Customer-specific information Y Year code (last digit of calendar year) YY Year code (last 2 digits of calendar year) WW Week code (week of January 1 is week ‘01’) NNN Alphanumeric traceability code Pb-free JEDEC designator for Matte Tin (Sn) * This package is Pb-free. The Pb-free JEDEC designator ( ) can be found on the outer packaging for this package. Note : In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line, thus limiting the number of available characters for customer-specific information. 3 e 3 e XXXXXXXX XXXXXNNN YYWW 8-Lead PDIP (300 mil) Example: 8-Lead SOIC (150 mil) Example: XXXXXXXX XXXXYYWW NNN 8-Lead TSSOP Example: MCP3002 I/P ^^256 0819 MCP3002I ISN ^^0819 256 8-Lead MSOP Example: XXXX YYWW NNN XXXXXX YWWNNN 3002 I819 256 3002I 819256 3 e 3 e |
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