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MCP621 Datenblatt(PDF) 31 Page - Microchip Technology

Teilenummer MCP621
Bauteilbeschribung  20 MHz, 2.5 mA Op Amps with mCal
PDF  44 Pages
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Hersteller  MICROCHIP [Microchip Technology]
Direct Link  http://www.microchip.com
Logo MICROCHIP - Microchip Technology

MCP621 Datenblatt(HTML) 31 Page - Microchip Technology

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© 2009 Microchip Technology Inc.
DS22188A-page 31
MCP621/2/5
6.0
PACKAGING INFORMATION
6.1
Package Marking Information
Legend: XX...X
Customer-specific information
Y
Year code (last digit of calendar year)
YY
Year code (last 2 digits of calendar year)
WW
Week code (week of January 1 is week ‘01’)
NNN
Alphanumeric traceability code
Pb-free JEDEC designator for Matte Tin (Sn)
*
This package is Pb-free. The Pb-free JEDEC designator (
)
can be found on the outer packaging for this package.
Note:
In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available
characters for customer-specific information.
3
e
3
e
8-Lead SOIC (150 mil) (MCP621, MCP622)
Example
:
XXXXXXXX
XXXXYYWW
NNN
MCP621E
SN
0921
256
3
e
8-Lead DFN (3x3) (MCP622)
Example:
XXXX
YYWW
NNN
DABL
0921
256
Device
Code
MCP622
DABL
Note: Applies to 8-Lead 3x3 DFN
10-Lead DFN (3x3) (MCP625)
10-Lead MSOP (MCP625)
Example:
XXXXXX
YWWNNN
625EUN
921256
Example:
XXXX
YYWW
NNN
BAFA
0921
256
Device
Code
MCP625
BAFA
Note: Applies to 10-Lead 3x3 DFN



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