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Datenblatt-Suchmaschine für elektronische Bauteile |
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Datenblatt-Suchmaschine für elektronische Bauteile |
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TL431AM Datenblatt(PDF) 3 Page - Estek Electronics Co. Ltd |
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TL431AM Datenblatt(HTML) 3 Page - Estek Electronics Co. Ltd |
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3 / 3 page  TL431AM (chips) 3 PAD LAYOUT Y 0,0 X Chip si z e: 0, 81x 0, 76 P ad si z e : 94 x 94 Uni t : µm PAD LOCATION Unit: µm Pad No. Pad Name Description X Y 1 R Reference -314 -299 2 A Anode -75 -275 3 K Cathode 231 -299 PHYSICAL CHARACTERISTIC Wafer dia 100 mm (4") * Wafer thickness 280 … 420 ±20 µm Scribe width 90 µm Passivation PSG Backside metallization Without metallization Min. lot yield 75% Min. wafer yield 60% * The wafer thickness small be specified in a PO or Contract 1 2 3 |
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