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AD5541ABCPZ Datenblatt(PDF) 19 Page - Analog Devices |
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AD5541ABCPZ Datenblatt(HTML) 19 Page - Analog Devices |
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19 / 24 page ![]() Rev. P rA | Page 19 of 24 TOP VIEW 8 1 5 4 0.35 0.30 0.25 EXPOSED PAD (BOTTOM VIEW) PIN 1 INDEX AREA 3.00 BSC SQ SEATING PLANE 0.80 0.75 0.70 0.20 REF 0.05 MAX 0.02 NOM 0.80 MAX 0.55 NOM 1.74 1.64 1.49 2.48 2.38 2.23 0.50 0.40 0.30 0.65 BSC PIN 1 INDICATOR (R 0.2) Figure 41. 8-Lead Lead Frame Chip Scale Package [LFCSP] (CP-8-3) Dimensions shown in millimeters. 16 9 8 1 PIN 1 SEATING PLANE 8° 0° 4.50 4.40 4.30 6.40 BSC 5.10 5.00 4.90 0.65 BSC 0.15 0.05 1.20 MAX 0.20 0.09 0.75 0.60 0.45 0.30 0.19 COPLANARITY 0.10 COMPLIANT TO JEDEC STANDARDS MO-153-AB Figure 42. 16-Lead Thin Shrink Small Outline Package [TSSOP] (RU-16) Dimensions shown in millimeters. |
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