MPC8535ECVTATH datasheet(111/126 Pages) FREESCALE

Teilenummer	MPC8535ECVTATH

Bauteilbeschribung	PowerQUICC??III Integrated Processor Hardware Specifications

PDF	126 Pages

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Hersteller	FREESCALE [Freescale Semiconductor, Inc]

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Thermal

MPC8535E PowerQUICC™ III Integrated Processor Hardware Specifications, Rev. 2

Freescale Semiconductor

111

Figure 72. System Level Thermal Model for MPC8535E (Not to Scale)

The Flotherm library files of the parts have a dense grid to accurately capture the laminar boundary layer for flow over the part

in standard JEDEC environments, as well as the heat spreading in the board under the package. In a real system, however, the

part will require a heat sink to be mounted on it. In this case, the predominant heat flow path will be from the die to the heat

sink. Grid density lower than currently in the package library file will suffice for these simulations. The user will need to

determine the optimal grid for their specific case.

2.24.3

Thermal Management Information

This section provides thermal management information for the flip chip plastic ball grid array (FC-PBGA) package for

air-cooled applications. Proper thermal control design is primarily dependent on the system-level design—the heat sink, airflow,

and thermal interface material.

Substrate

Die

Bump/underfill

Section A-A

Solder/air

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