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BAS40 Datenblatt(PDF) 18 Page - NXP Semiconductors |
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BAS40 Datenblatt(HTML) 18 Page - NXP Semiconductors |
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18 / 21 page ![]() BAS40_1PSXXSB4X_SER_8 © NXP B.V. 2010. All rights reserved. Product data sheet Rev. 08 — 13 January 2010 18 of 21 NXP Semiconductors BAS40 series; 1PSxxSB4x series General-purpose Schottky diodes Fig 28. Reflow soldering footprint SOT416 Reflow soldering is the only recommended soldering method. Fig 29. Reflow soldering footprint SOT666 solder resist occupied area solder lands solder paste Dimensions in mm msa438 2.0 0.6 (3x) 0.7 1.5 1 2 3 1.1 2.2 0.5 (3x) 0.85 0.6 1.9 solder lands placement area occupied area solder paste sot666_fr 2.75 2.45 2.1 1.6 0.4 (6 ×) 0.55 (2 ×) 0.25 (2 ×) 0.6 (2 ×) 0.65 (2 ×) 0.3 (2 ×) 0.325 (4 ×) 0.45 (4 ×) 0.5 (4 ×) 0.375 (4 ×) 1.7 2 1.7 1.075 0.538 Dimensions in mm |
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