© 2008 Microchip Technology Inc.

DS21811E-page 23

MCP6281/1R/2/3/4/5

8-Lead Plastic Micro Small Outline Package (MS) [MSOP]

Notes:

1. Pin 1 visual index feature may vary, but must be located within the hatched area.

2. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.15 mm per side.

3. Dimensioning and tolerancing per ASME Y14.5M.

BSC: Basic Dimension. Theoretically exact value shown without tolerances.

REF: Reference Dimension, usually without tolerance, for information purposes only.

Note:

For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

Units

MILLIMETERS

Dimension Limits

MIN

NOM

MAX

Number of Pins

N

8

Pitch

e

0.65 BSC

Overall Height

A

–

–

1.10

Molded Package Thickness

A2

0.75

0.85

0.95

Standoff

A1

0.00

–

0.15

Overall Width

E

4.90 BSC

Molded Package Width

E1

3.00 BSC

Overall Length

D

3.00 BSC

Foot Length

L

0.40

0.60

0.80

Footprint

L1

0.95 REF

Foot Angle

φ

0°

–

8°

Lead Thickness

c

0.08

–

0.23

Lead Width

b

0.22

–

0.40

D

N

E

E1

NOTE 1

1

2

e

b

A

A1

A2

c

L1

L

φ

Microchip Technology Drawing C04-111B