STIEC45-XXAS

Characteristics

Doc ID 16871 Rev 1

5/9

Figure 9.

Leakage current versus junction temperature (typical values)

Figure 7.

Relative variation of thermal

impedance, junction to ambient,

versus pulse duration

Figure 8.

Thermal resistance junction to

ambient versus copper surface

under each lead

Z

0.0

0.1

0.2

0.3

0.4

0.5

0.6

0.7

0.8

0.9

1.0

1.E-01

1.E+00

1.E+01

1.E+02

1.E+03

Single pulse

Recommended pad layout

PCB FR4, copper thickness = 35 µm

0

10

20

30

40

50

60

70

80

90

100

0.0

0.5

1.0

1.5

2.0

2.5

3.0

3.5

4.0

4.5

5.0

PCB FR4, copper thickness = 35 µm

R

(°C/W)

th(j-a)

1.E+00

1.E+01

1.E+02

1.E+03

25

50

75

100

125

150

V