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PSII30/12 Datenblatt(PDF) 1 Page - Powersem GmbH

Teilenummer PSII30/12
Bauteilbeschribung  IGBT Module
PDF  4 Pages
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Hersteller  POWERSEM [Powersem GmbH]
Direct Link  http://www.powersem.com
Logo POWERSEM - Powersem GmbH

PSII30/12 Datenblatt(HTML) 1 Page - Powersem GmbH

  PSII30/12 Datasheet HTML 1Page - Powersem GmbH PSII30/12 Datasheet HTML 2Page - Powersem GmbH PSII30/12 Datasheet HTML 3Page - Powersem GmbH PSII30/12 Datasheet HTML 4Page - Powersem GmbH  
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background image
tentative
data
sheet
product
still
under
development
IGBT Module
I
C80
=
33 A
V
CES
=
1200 V
V
CE(sat)typ. =
3.1 V
POWERSEM GmbH, Walpersdorfer Str. 53
D - 91126 Schwabach
Phone: 09122 - 9764 - 0 FAX: 09122 - 9764 - 20
ECO-TOPTM 1
2005 POWERSEM reserves the right to change limits, test conditions and dimensions
Preliminary Data Sheet
Caution: These Devices are sensitive
to electrostatic discharge. Users should
observe proper ESD handling precautions.
PSII 30/12*
*NTC optional
Short Circuit SOA Capability
Square RBSOA
IGBTs
Symbol
Conditions
Maximum Ratings
V
CES
T
VJ = 25°C to 150°C
1200
V
V
GES
± 20
V
I
C25
T
C = 25°C
49
A
I
C80
T
C = 80°C
33
A
I
CM
V
GE = ±15 V; RG = 47 Ω; TVJ = 125°C
50
A
V
CEK
RBSOA, Clamped inductive load; L = 100 µH
V
CES
t
SC
V
CE = VCES; VGE = ±15 V; RG = 47 Ω; TVJ = 125°C
10
µs
(SCSOA)
non-repetitive
P
tot
T
C = 25°C
208
W
Symbol
Conditions
Characteristic Values
(T
VJ = 25°C, unless otherwise specified)
min.
typ.
max.
V
CE(sat)
I
C = 50 A; VGE = 15 V; TVJ =
25°C
3.1
3.7
V
T
VJ = 125°C
3.5
V
V
GE(th)
I
C = 1 mA; VGE = VCE
4.5
6.5
V
I
CES
V
CE = VCES;VGE = 0 V;
T
VJ =
25°C
1.1 mA
T
VJ = 125°C
4.2 mA
I
GES
V
CE = 0 V; VGE =
± 20 V
180
nA
t
d(on)
100
ns
t
r
70
ns
t
d(off)
500
ns
t
f
70
ns
E
on
4.6
mJ
E
off
3.4
mJ
C
ies
V
CE = 25 V; VGE = 0 V; f = 1 MHz
1.65
nF
R
thJC
(per IGBT)
0.6 K/W
R
thJH
with heatsink compound (0.42 K/m.K; 50 µm)
1.2
K/W
Inductive load, T
VJ = 125°C
V
CE = 600 V; IC = 30 A
V
GE = 15/0 V; RG = 47 Ω
Features
•
Package with DCB ceramic
base plate
•
Isolation voltage 3000 V
∼
•
Planar glass passivated chips
•
Low forward voltage drop
•
Leads suitable for PC board
soldering
•
UL Release applied
Applications
•
AC and DC motor control
•
AC servo and robot drives
•
Power supplies
•
Welding inverters
Advantages
•
Easy to mount with four screws
•
Space and weight savings
•
Improved temperature and
power cycling capability
•
High power density
•
Small and light weight
ECO-TOPTM 1
V3
V6
N1
G1
Q1
V10
V9
N15
K1
V13
V12
G15
V1
U1
A1
S15
D1
A9
A7
A15
R15
typical picture, for pin
configuration see outline
drawing


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