Product Preview

WM8733

WOLFSON MICROELECTRONICS LTD

PP Rev 1.3 July 2000

11

PACKAGE DIMENSIONS

NOTES:

A. ALL LINEAR DIMENSIONS ARE IN MILLIMETERS (INCHES).

B. THIS DRAWING IS SUBJECT TO CHANGE WITHOUT NOTICE.

C. BODY DIMENSIONS DO NOT INCLUDE MOLD FLASH OR PROTRUSION, NOT TO EXCEED 0.25MM (0.010IN).

D. MEETS JEDEC.95 MS-012, VARIATION = AB. REFER TO THIS SPECIFICATION FOR FURTHER DETAILS.

Symbols

Dimensions

(MM)

Dimensions

(Inches)

MIN

MAX

MIN

MAX

A

1.35

1.75

0.0532

0.0688

A1

0.10

0.25

0.0040

0.0098

B

0.33

0.51

0.0130

0.0200

C

0.19

0.25

0.0075

0.0098

D

8.55

8.75

0.3367

0.3444

E

3.80

4.00

0.1497

0.1574

e

1.27 BSC

0.05 BSC

H

5.80

6.20

0.2284

0.2440

h

0.25

0.50

0.0099

0.0196

L

0.40

1.27

0.0160

0.0500

α

0

o

8

o

0

o

8

o

REF:

JEDEC.95, MS-012

0.10 (0.004)

SEATING PLANE

DM001.C

E

D: 14 PIN SOIC 3.9mm Wide Body

H

B

D

A

A1

C

-C-

8

7

1

14

α

L

e