BH2227FV, BH2228FV

Technical Note

7/8

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2009.06 - Rev.A

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Operation Notes

(1) Absolute maximum ratings

Operating or testing the device over the maximum specifications may damage the part itself as well as peripheral

components. Therefore, please ensure that the specifications are not exceeded.

(2) GND potential

Ensure that the GND terminal is at the lowest potential under all operating conditions.

(3) Thermal design

Use a thermal design that allows for a sufficient margin regarding power dissipation (Pd) under actual operating

conditions.

(4) Terminal shorts and mis-mounting

Incorrect orientation or misalignment of the IC when mounting to the PCB may damage part. Short-circuits caused by The

introduction of foreign matter between the output terminals or across the output and power supply or GND may also

result in destruction.

(5) Operation in a strong magnetic field

Operation in a strong electromagnetic field may cause malfunction.

(6) Set the power source voltage so that VDD ≧ VFS.

(7) Reset function

The power on reset circuit, which initializes internal settings, may malfunction during abrupt power ons.

Therefore, set the time constant so as to satisfy the power source rise time.

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Thermal Derating Curve

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SSOP-B14

Board size : 70 x 70 x 1.6mm Material : FR4 glass epoxy board (copper foil area less than 3%)

Fig.18

0

100

200

300

400

500

0

25

50

75

100

125

Ta [℃]