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LPC2104FBD48/01 Datenblatt(PDF) 26 Page - NXP Semiconductors |
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LPC2104FBD48/01 Datenblatt(HTML) 26 Page - NXP Semiconductors |
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26 / 41 page ![]() LPC2104_2105_2106_7 © NXP B.V. 2008. All rights reserved. Product data sheet Rev. 07 — 20 June 2008 26 of 41 NXP Semiconductors LPC2104/2105/2106 Single-chip 32-bit microcontrollers 7. Limiting values [1] The following applies to Table 8: a) This product includes circuitry specifically designed for the protection of its internal devices from the damaging effects of excessive static charge. Nonetheless, it is suggested that conventional precautions be taken to avoid applying greater than the rated maximum. b) Parameters are valid over operating temperature range unless otherwise specified. All voltages are with respect to VSS unless otherwise noted. [2] Internal rail. [3] External rail. [4] Including voltage on outputs in 3-state mode. [5] Only valid when the VDD(3V3) supply voltage is present. [6] Not to exceed 4.6 V. [7] Per supply pin. [8] The peak current is limited to 25 times the corresponding maximum current. [9] Per ground pin. [10] Dependent on package type. [11] Human body model: equivalent to discharging a 100 pF capacitor through a 1.5 k Ω series resistor. [12] Machine model: equivalent to discharging a 200 pF capacitor through a 0.75 µH coil and a 10 Ω series resistor. Table 8. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134).[1] Symbol Parameter Conditions Min Max Unit VDD(1V8) supply voltage (1.8 V) [2] −0.5 +2.5 V VDD(3V3) supply voltage (3.3 V) [3] −0.5 +3.6 V VI input voltage 5 V tolerant I/O pins [4][5] −0.5 +6.0 V other I/O pins [4][6] −0.5 VDD(3V3) + 0.5 V IDD supply current [7][8] - 100 mA ISS ground current [8][9] - 100 mA Tstg storage temperature [10] −65 +150 °C Ptot(pack) total power dissipation (per package) based on package heat transfer, not device power consumption - 1.5 W Vesd electrostatic discharge voltage human body model [11] all pins −2000 +2000 V machine model [12] all pins −200 +200 V |
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