2111 Comprehensive Drive

Aurora, Illinois 60505

Phone: 630-851-4722

Fax: 630-851-5040

www.conwin.com

Specifications subject to change without notice. All dimensions in inches. © Copyright 2008 The Connor-Winfield Corporation

US Headquarters:

630-851-4722

European Headquarters:

+353-61-472221

Bulletin

Page

Revision

Date

Tx243

2of2

01

01 May 2009

1

0.276 0.006

(7.0mm)

±

0.197

0.006

(5.0mm)

±

0.079 Max.

(2.0mm)

0.025(6 Places)

(0.635mm)

0.100

(2.54mm)

0.040

(1.02mm)

(6 Places)

0.030

(0.762mm)

(4 Places)

0.100

(2.54mm)

Pin 1

0.038

(0.965mm)

(4 Places)

D75AS 0847

20.0MHz

Dimensional Tolerance:

±.005 (.127mm)

±.02 (.508mm)

1

23

4

5

6

7

8

9

10

120°C

150°C

180°C

260°C

0

220°C

360 Sec. Max.

120 S

Max.

10 S

60 S

Max.

Time

Temperature

260°C

Pad

Connection

1

Do not connect

2

Do not connect

3

Do not connect

4

Ground

5

Output

6

Do not connect

7

Do not connect

8

Enable / Disable

9

Supply, Vcc

10

Do not connect

Pad Connections

Package Layout

Suggested Pad Layout

Solder Profile

Output Waveform

Test Circuit

Ordering Information

D75AS - 020.0MHZ *

Tape and Reel Information

Environmental Characteristics

Vibration:

Vibration per Mil Std 883E Method 2007.3 Test Condition A

Shock:

Mechanical Shock per Mil Std 883E Method 2002.4 Test Condition B.

Soldering:

SMD product suitable for Convection Reflow soldering. Peak temperature

260

°C. Maximum time above 220°C, 60 seconds.

Solderability

Solderability per Mil Std 883E Method 2003

Package Characteristics

Package

Ceramic Surface Mount Package.

Design Recommendations

TCXO

SERIES

CENTER

FREQUENCY

TCXO

SERIES

CENTER

FREQUENCY

OSC

TOP LAYER

GROUND LAYER

BOTTOM LAYER

Output

Buffer

50 Ohm Trace

Without

Vias

Vcc, should have

a large copper

area for reduced

inductance.

Connect a 0.01uF

bypass capacitor

<0.1”(2.54mm)

from the pad.

Ground,

should have

a large copper

area for reduced

inductance.

0.010”(0.254mm)

Recommended

clearance

inductance

for internal

copper flood.

Top View

1

3

4

5

6

8

9

10

Buffer

Ground

Buffer

should be equivalent to

50 Ohm trace

<1”by design

input load

15pF.

Vcc

Ground

Top View

Do not route any traces in the keep out area.

It is recommended the next layer under the

keep out area is to be ground plane.

0.215

(5.46mm)

0.037

(0.94mm)

0.051

(1.28mm)

0.051

(1.28mm)

0.295

(7.49mm)

0.030

(0.76mm)

Top View

1

* Do not route any traces in the keep out area.

It is recommended the next layer under the

keep out area is to be ground plane.

Keep Out Area*

* For the tape and reel option,

add -T to the end of the part number.

Example: D75AS-020.0 MHZ -T

Vcc

Supply

Voltage

.01 uF

Bypass

3

5

4

8

7

6

2

1

10

9

DNC

DNC

DNC DNC

DNC DNC

Output

10 pF**

E/D

DNC = Do Not Connect

E/D = Enable / Disable

** NPO Grade component

10Kohm

10ns 200mV