ISO7521 datasheet(10/15 Pages) TI

10 / 15 page

ISO7520

ISO7521

SLLSE39 – JUNE 2010

www.ti.com

INSULATION CHARACTERISTICS

over recommended operating conditions (unless otherwise noted)

PARAMETER

TEST CONDITIONS

SPECIFICATION

UNIT

VTEST = 1.875 × VIORM, PD ≤ 5pC,

Vpeak/

VIORM

Maximum working insulation voltage

t = 10 sec (qualification)

1300/920

Vrms

t = 1 sec (100% production)

VTEST = VIOTM,

Vpeak/

VIOTM

Transient overvoltage

t = 60 sec (qualification)

4000/2858

Vrms

t= 1 sec (100% production)

VTEST = VISO

7000/5000

Vpeak/

VISO

Isolation voltage per UL

t = 60 sec (qualification), VTEST = 1.2 × VISO,

8400/6000

Vrms

t = 1 sec (100% production)

Insulation resistance

VTEST = 500 V at TS = 150C

>109

Pollution degree

REGULATORY INFORMATION

VDE

CSA

Approved under CSA Component Acceptance

Recognized under 1577 Component

Certified according to IEC 60747-5-2

Notice

Recognition Program

File Number: pending

IEC SAFETY LIMITING VALUES

Safety limiting intends to prevent potential damage to the isolation barrier upon failure of input or output circuitry.

A failure of the IO can allow low resistance to ground or the supply and, without current limiting, dissipate

sufficient power to overheat the die and damage the isolation barrier potentially leading to secondary system

failures.

PARAMETER

TEST CONDITIONS

MIN

TYP

MAX

UNIT

qJA =79.9 °C/W, VI = 5.25 V, TJ = 150 °C, TA = 25

298

°C

Safety input, output, or supply current

qJA =79.9 °C/W, VI = 3.45 V, TJ = 150 °C, TA = 25

453

°C

Maximum Case Temperature

150

°C

The safety-limiting constraint is the absolute maximum junction temperature specified in the absolute maximum

ratings table. The power dissipation and junction-to-air thermal impedance of the device installed in the

application hardware determines the junction temperature. The assumed junction-to-air thermal resistance in the

Thermal Characteristics table is that of a device installed on a High-K Test Board for Leaded Surface Mount

Packages. The power is the recommended maximum input voltage times the current. The junction temperature is

then the ambient temperature plus the power times the junction-to-air thermal resistance.

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