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SN74LVC2GU04DBVT Datenblatt(PDF) 1 Page - Texas Instruments

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Teilenummer SN74LVC2GU04DBVT
Bauteilbeschribung  DUAL INVERTER GATE
PDF  14 Pages
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Hersteller  TI [Texas Instruments]
Direct Link  http://www.ti.com
Logo TI - Texas Instruments

SN74LVC2GU04DBVT Datenblatt(HTML) 1 Page - Texas Instruments

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FEATURES
Seemechanicaldrawingsfordimensions.
DBVPACKAGE
(TOP VIEW)
DCKPACKAGE
(TOP VIEW)
2
GND
V
CC
5
3
4
2A
2Y
6
1
1A
1Y
3
4
2A
2
GND
2Y
5
1
1A
V
CC
6
1Y
YZP PACKAGE
(BOTTOMVIEW)
2
GND
V
CC
1
5
1A
2A
4
3
2Y
6
1Y
DESCRIPTION/ORDERING INFORMATION
SN74LVC2GU04
DUAL INVERTER GATE
SCES197M – APRIL 1999 – REVISED FEBRUARY 2007
• Available in the Texas Instruments
• Typical V
OHV (Output VOH Undershoot) >2 V at
NanoFree™ Package
V
CC = 3.3 V, TA = 25°C
• Supports 5-V V
CC Operation
• Unbuffered Outputs
• Inputs Accept Voltages to 5.5 V
• Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II
• Max t
pd of 3.7 ns at 3.3 V
• ESD Protection Exceeds JESD 22
• Low Power Consumption, 10-µA Max I
CC
–
2000-V Human-Body Model (A114-A)
• ±24-mA Output Drive at 3.3 V
–
200-V Machine Model (A115-A)
• Typical V
OLP (Output Ground Bounce) <0.8 V
at V
CC = 3.3 V, TA = 25°C
–
1000-V Charged-Device Model (C101)
This dual inverter is designed for 1.65-V to 5.5-V VCC operation.
The SN74LVC2GU04 contains two inverters with unbuffered outputs and performs the Boolean function Y = A.
NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the die as the
package.
ORDERING INFORMATION
TA
PACKAGE(1)
ORDERABLE PART NUMBER
TOP-SIDE MARKING(2)
NanoFree™ – WCSP (DSBGA)
0.23-mm Large Bump – YZP
Reel of 3000
SN74LVC2GU04YZPR
_ _ _CD_
(Pb-free)
Reel of 3000
SN74LVC2GU04DBVR
–40°C to 85°C
SOT (SOT-23) – DBV
CU4_
Reel of 250
SN74LVC2GU04DBVT
SN74LVC2GU04DCKR
SOT (SC-70) – DCK
Reel of 3000
CD_
SN74LVC2GU04DCKT
(1)
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/sc/package.
(2)
DBV/DCK: The actual top-side marking has one additional character that designates the assembly/test site.
YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following
character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb,
• = Pb-free).
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
NanoFree is a trademark of Texas Instruments.
PRODUCTION DATA information is current as of publication date.
Copyright © 1999–2007, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.


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