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TUSB9260PAP Datenblatt(PDF) 16 Page - Texas Instruments

Teilenummer TUSB9260PAP
Bauteilbeschribung  USB 3.0 TO SATA BRIDGE
PDF  21 Pages
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Hersteller  TI [Texas Instruments]
Direct Link  http://www.ti.com
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TUSB9260PAP Datenblatt(HTML) 16 Page - Texas Instruments

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TUSB9260
SLLS962C – DECEMBER 2009 – REVISED JULY 2010
www.ti.com
5.3
Oscillator
XI should be tied to the 1.8-V clock source and XO should be left floating.
VSSOSC should be connected to the PCB ground plane.
A 40-MHz clock can be used.
Table 5-1. Oscillator Specification
PARAMETER
CONDITIONS
MIN
TYP
MAX
UNIT
VDDIO = 1.8 V,
CXI
XI input capacitance
0.414
pF
TJ = 25°C
VIL
Low-level input voltage
0.35 x VDDR18
V
VIH
High-level input voltage
0.65 x VDDR18
V
Ttosc_i
Frequency tolerance
Operational temperature
–50
50
ppm
Tduty
Duty cycle
45
50
55
%
TR/TF
Rise/Fall time
20% - 80 %
6
ns
RJ
Reference clock RJ
JTF (1 sigma)(1)(2)
0.8
ps
TJ
Reference clock TJ
JTF (total p-p)(2)(3)
25
ps
Tp-p
Reference clock jitter
(absolute p-p)(4)
50
ps
(1)
Sigma value assuming Gaussian distribution
(2)
After application of JTF
(3)
Calculated as 14.1 x RJ + DJ
(4)
Absolute phase jitter (p-p)
5.4
Crystal
A parallel, 20-pF load capacitor should be used if a crystal source is used.
VSSOSC should not be connected to the PCB ground plane.
A 40-MHz crystal can be used.
Table 5-2. Crystal Specification
PARAMETER
CONDITIONS
MIN
TYP
MAX
UNIT
Ttosc_i
Frequency tolerance
Operational temperature
–50
50
ppm
Frequency stability
1 year aging
–50
50
ppm
CL
Load capacitance
12
20
24
pF
16
CLOCK CONNECTIONS
Copyright © 2009–2010, Texas Instruments Incorporated
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