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MF1S5009DA4 Datenblatt(PDF) 2 Page - NXP Semiconductors

Teilenummer MF1S5009DA4
Bauteilbeschribung  Mainstream contactless smart card IC for fast and easy solution development
PDF  32 Pages
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Hersteller  NXP [NXP Semiconductors]
Direct Link  http://www.nxp.com
Logo NXP - NXP Semiconductors

MF1S5009DA4 Datenblatt(HTML) 2 Page - NXP Semiconductors

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MF1S5009
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2010. All rights reserved.
Product data sheet
PUBLIC
Rev. 3 — 27 July 2010
189131
2 of 32
NXP Semiconductors
MF1S5009
Mainstream contactless smart card IC
1.4 Security
Unique identifier for each device using double size UID (7 byte UID)
Mutual three pass authentication (ISO/IEC 9798-2)
Individual set of two keys per sector (per application) to support multi-application with
key hierarchy
1.5 Delivery options
Bumped die on wafer
MOA4 contactless module
2.
Features and benefits
2.1 MIFARE‚ RF Interface (ISO/IEC 14443 A)
Contactless transmission of data and supply energy (no battery needed)
Operating distance up to 100 mm depending on antenna geometry and reader
configuration
Operating frequency of 13.56 MHz
Data transfer of 106 kbit/s
Data integrity of 16-bit CRC, parity, bit coding, bit counting
Anticollision
Typical ticketing transaction time of < 100 ms (including backup management)
2.2 EEPROM
1 kB, organized in 16 sectors with 4 blocks of 16 bytes each (one block consists of
16 byte)
User definable access conditions for each memory block
Data retention time of 10 years
Write endurance 100000 cycles



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