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©2010 Littelfuse, Inc.

Revised: August 19, 2010

SPA™ Silicon Protection Array Products

Specifications are subject to change without notice.

Please refer to http://www.littelfuse.com for current information.

Low Capacitance ESD Protection Array

SP3003 Lead-Free/Green Series

Package Dimensions — SC70-6

D

A2 A

A1

C

L

E

HE

2

1

3

6

5

4

e

e

B

Package

SC70-6

Pins

6

JEDEC

MO-203 Issue A

Millimeters

Inches

Min

Max

Min

Max

A

0.80

1.10

0.031

0.043

A1

0.00

0.10

0.000

0.004

A2

0.70

1.00

0.028

0.039

B

0.15

0.30

0.006

0.012

c

0.08

0.25

0.003

0.010

D

1.85

2.25

0.073

0.089

E

1.15

1.35

0.045

0.053

e

0.65 BSC

0.026 BSC

HE

2.00

2.40

0.079

0.094

L

0.26

0.46

0.010

0.018

Solder Pad Layout

Package Dimensions — SC70-5

D

A2 A

A1

C

L

E

HE

2

1

3

6

5

not used

4

e

e

B

Package

SC70-5

Pins

5

JEDEC

MO-203 Issue A

Millimeters

Inches

Min

Max

Min

Max

A

0.80

1.10

0.031

0.043

A1

0.00

0.10

0.000

0.004

A2

0.70

1.00

0.028

0.039

B

0.15

0.30

0.006

0.012

c

0.08

0.25

0.003

0.010

D

1.85

2.25

0.073

0.089

E

1.15

1.35

0.045

0.053

e

0.65 BSC

0.026 BSC

HE

2.00

2.40

0.079

0.094

L

0.26

0.46

0.010

0.018

Solder Pad Layout

Package Dimensions — SOT553

Package

SOT 553

Pins

5

Millimeters

Inches

Min

Max

Min

Max

A

0.50

0.60

0.020

0.024

B

0.17

0.27

0.007

0.011

c

0.08

0.18

0.003

0.007

D

1.50

1.70

0.059

0.067

E

1.10

1.30

0.043

0.051

e

0.50 BSC

0.020 BSC

L

0.10

0.30

0.004

0.012

HE

1.50

1.70

0.059

0.067

c

HE

L

A

D

6

4

2

3

E

e

B

5

(not used)

Solder Pad Layout