AL3158 datasheet(3/10 Pages) DIODES

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AL3158

HIGH EFFICIENCY 1x/2x CHARGE PUMP

FOR WHITE LED APPLICATIONS

AL3158

Document number: DS35047 Rev. 1 - 2

3 of 10

www.diodes.com

September 2010

Absolute Maximum Ratings (Note 2)

Symbol

Description

Rating

Unit

ESD HBM

Human Body Model ESD Protection

ESD MM

Machine Model ESD Protection

200

VIN

Input Voltage

-0.3 to 6

VEN1,2,3

EN1, EN2, EN3 to GND Voltage

-0.3 to VIN +0.3

IOUT

Maximum DC Output Current

270

Operating Junction Temperature Range

150

°C

TLEAD

Maximum Soldering Temperature (at leads, 10 sec)

300

°C

Notes:

2. Exceeding Absolute Maximum Ratings will cause permanent damage to the device.

Recommended Operating Conditions

Symbol

Parameter

Min

Max

Unit

VIN

Input Voltage

2.7

5.5

Operating Ambient Temperature

-40

°C

Electrical Characteristics (TA = 25°C, Vin = 3.6V, CIN = COUT = 2.2µF, C1 = 1µF Unless otherwise noted)

Symbol

Parameter

Test Conditions

Min

Typ.

Max

Unit

Quiescent Current

1x Mode, 3.0≤VIN≤5.5, Active,

No Load Current

0.3

0.6

2x Mode, 3.0≤VIN≤5.5, Active,

No Load Current

ISHDN

Shutdown Current

EN1, EN2, EN3 = 0

µA

IDX

ISINK Current Accuracy (Note 3)

ISET = 20mA (Note 4), TA = 25°C

ID-Match

Current Matching Between Any Two

Current Sink Inputs (Note 5)

VF: D1:D9 = 3.6V

Rout

Open Loop VOUT Resistance

1x mode

0.5

2 x mode

4.5

VTH

1x to 2x Transition Threshold at Any

ISINK Pin

ISET = 20mA

150

VHS

Mode Transition Hysteresis

250

TSS

Soft-Start Time

100

µs

Fsw

Switching Frequency

1.2

MHz

VEN1, 2,3 (L)

EN1,2,3 Threshold Low

VIN = 2.7V

0.4

VEN1,2,3(H)

EN1,2,3 Threshold High

VIN = 5.5V

1.4

TEN1,2,3

EN1,2,3 Off Timeout

UVLO

VIN Under-Voltage Lockout

1.8

2.2

IEN1,2,3

EN1,2,3 Input Leakage

-1

µA

TSHDN

Thermal shutdown Protection

160

°C

THYS

Thermal shutdown hysteresis

°C

θJA

Thermal Resistance Junction-to-

Ambient

QFN3030-20 (Note 6)

oC/W

Notes: 3. Determined by the average current levels of all active channels.

4. Sequence setting set to give nominal 20mA max output current and 4mA output current.

5. Determined by the maximum sink current (MAX), the minimum sink current (MIN), and the average sink current (AVG). Two matching numbers are

calculated as (MAX-AVG)/AVG and (AVG-MIN)/AVG. The largest number of the two (worst case) is considered as the matching data.

6. Device mounted on FR-4 substrate, 2"*2", 2oz copper, double-sided PC board, with minimum recommended pad on top layer and

4 vias to bottom layer.

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