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MCP1602 Datenblatt(PDF) 11 Page - Microchip Technology |
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MCP1602 Datenblatt(HTML) 11 Page - Microchip Technology |
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11 / 26 page ![]() © 2007 Microchip Technology Inc. DS22061A-page 11 MCP1602 3.0 PIN DESCRIPTIONS The descriptions of the pins are listed in Table 3-1. TABLE 3-1: PIN FUNCTION TABLE 3.1 Shutdown Control Input Pin (SHDN) The SHDN pin is a logic-level input used to enable or disable the device. A logic high (>45% of VIN) will enable the regulator output. A logic-low (<15% of VIN) will ensure that the regulator is disabled. 3.2 Analog Input Supply Voltage Pin (VCC) The VCC pin provides bias for internal analog functions. This voltage is derived by filtering the VIN supply. 3.3 Power-Good Output Pin (PG) PG is an output level indicating that the output voltage is within 94% of regulation. The PG output is configured as an open-drain output. 3.4 Analog Ground Pin (AGND) AGND is the analog ground connection. Tie AGND to the analog portion of the ground plane (AGND). See the physical layout information in the Section 5.8 “PCB Layout Information” section for ground recommenda- tions. 3.5 Output Voltage Sense Pin (VFB/ VOUT) For the adjustable output voltage options, connect the center of the output voltage divider to the VFB pin. For fixed-output voltage options, connect the output of the buck regulator to this pin (VOUT). 3.6 Power Supply Input Voltage Pin (VIN) VIN is the buck regulator power input supply pin. Connect a variable input voltage source to VIN. 3.7 Buck Inductor Output Pin (LX) Connect LX directly to the buck inductor. This pin carries large signal-level current; all connections should be made as short as possible. 3.8 Power Ground Pin (PGND) Connect all large signal level ground returns to PGND. These large signal level ground traces should have a small loop area and length to prevent coupling of switching noise to sensitive traces. 3.9 Exposed Metal Pad (EP) For the DFN package, connect the Exposed Pad to AGND, with vias into the AGND plane. This connection to the AGND plane will aid in heat removal from the package. MSOP DFN Sym Description 1 1 SHDN Shutdown Input Pin 22 VCC Analog Input Supply Voltage Pin 3 3 PG Power Good Output Pin 44 AGND Analog Ground Pin 55 VFB/VOUT Feedback Voltage (Adjustable Version) / Output Voltage (Fixed Version) Pin 66 VIN Input Supply Voltage Pin 77 LX Buck Inductor Output Pin 88 PGND Power Ground Pin — Exposed Pad EP For the DFN package, the center exposed pad is a thermal path to remove heat from the device. Electrically this pad is at ground potential and should be connected to AGND |
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