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Datenblatt-Suchmaschine für elektronische Bauteile |
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Datenblatt-Suchmaschine für elektronische Bauteile |
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E2000 Datenblatt(PDF) 38 Page - Intel Corporation |
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E2000 Datenblatt(HTML) 38 Page - Intel Corporation |
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38 / 104 page  Package Mechanical Specifications 38 Datasheet 3.5 Package Insertion Specifications The processor can be inserted into and removed from a LGA775 socket 15 times. The socket should meet the LGA775 requirements detailed in the LGA775 Socket Mechanical Design Guide. 3.6 Processor Mass Specification The typical mass of the processor is 21.5 g [0.76 oz]. This mass [weight] includes all the components that are included in the package. 3.7 Processor Materials Table 22 lists some of the package components and associated materials. 3.8 Processor Markings Figure 11 shows the topside markings on the processors. This diagram aids in the identification of the processor. Table 22. Processor Materials Component Material Integrated Heat Spreader (IHS) Nickel Plated Copper Substrate Fiber Reinforced Resin Substrate Lands Gold Plated Copper Figure 11. Processor Top-Side Markings Example ATPO S/N INTEL ©'05 E2160 PENTIUM® DUAL-CORE SLxxx [COO] 1.80GHZ/1M/800/06 [FPO] M e4 |
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