M24C32-R datasheet(31/38 Pages) STMICROELECTRONICS

31 / 38 page

M24C32-W M24C32-R M24C32-F

Package mechanical data

Doc ID 4578 Rev 17

31/38

Figure 16.

UFDFPN8 (MLP8) – 8-lead ultra thin fine pitch dual flat package no lead

2 × 3mm, package outline

Drawing is not to scale.

The central pad (the E2 × D2 area in the above illustration) is internally pulled to VSS. It should not be

connected to any other voltage or signal line on the PCB, for example during the soldering process.

Table 20.

UFDFPN8 (MLP8) – 8-lead ultra thin fine pitch dual flat package no lead

2 × 3mm, package mechanical data

Symbol

millimeters

inches(1)

Values in inches are converted from mm and rounded to 4 decimal digits.

Typ

Min

Max

Typ

Min

Max

0.55

0.50

0.60

0.0217

0.0197

0.0236

0.02

0.00

0.05

0.0008

0.0020

0.25

0.20

0.30

0.0098

0.0079

0.0118

2.00

1.90

2.10

0.0787

0.0748

0.0827

1.60

1.50

1.70

0.0630

0.0591

0.0669

ddd

0.08

0.0031

3.00

2.90

3.10

0.1181

0.1142

0.1220

0.20

0.10

0.30

0.0079

0.0039

0.0118

e0.50–

–

0.0197

–

0.45

0.40

0.50

0.0177

0.0157

0.0197

0.15

0.0059

0.30

0.0118

UFDFPN-01

ddd

M24C32-R Datenblatt(PDF) 31 Page - STMicroelectronics

M24C32-R Datenblatt(HTML) 31 Page - STMicroelectronics

Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38

Datenblatt Download

Link URL