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STM32F101X8 Datenblatt(PDF) 33 Page - STMicroelectronics

Teilenummer STM32F101X8
Bauteilbeschribung  Medium-density access line, ARM-based 32-bit MCU with 64 or 128 KB Flash, 6 timers, ADC and 7 communication interfaces
PDF  85 Pages
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Hersteller  STMICROELECTRONICS [STMicroelectronics]
Direct Link  http://www.st.com
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STM32F101X8 Datenblatt(HTML) 33 Page - STMicroelectronics

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STM32F101x8, STM32F101xB
Electrical characteristics
Doc ID 13586 Rev 13
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5.3.2
Operating conditions at power-up / power-down
Subject to general operating conditions for TA.
Table 9.
Operating conditions at power-up / power-down
5.3.3
Embedded reset and power control block characteristics
The parameters given in Table 10 are derived from tests performed under the ambient
temperature and VDD supply voltage conditions summarized in Table 8.
P
D
Power dissipation at TA =
85 °C(3)
LQFP100
434
mW
LQFP64
444
LQFP48
363
VFQFPN36
1110
TA
Ambient temperature
Maximum power dissipation
–40
85
°C
Low power dissipation(4)
–40
105
°C
TJ
Junction temperature range
–40
105
°C
1.
When the ADC is used, refer to Table 41: ADC characteristics.
2.
It is recommended to power VDD and VDDA from the same source. A maximum difference of 300 mV
between VDD and VDDA can be tolerated during power-up and operation.
3.
If TA is lower, higher PD values are allowed as long as TJ does not exceed TJmax (see Table 6.2: Thermal
characteristics on page 76).
4.
In low power dissipation state, TA can be extended to this range as long as TJ does not exceed TJmax (see
Table 6.2: Thermal characteristics on page 76).
Table 8.
General operating conditions (continued)
Symbol
Parameter
Conditions
Min
Max
Unit
Symbol
Parameter
Conditions
Min
Max
Unit
tVDD
VDD rise time rate
0
µs/V
VDD fall time rate
20



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