R8CL3AB datasheet(3/89 Pages) RENESAS

3 / 89 page

REJ03B0243-0030 Rev.0.30

Jan 21, 2009

Page 1 of 76

R8C/L35A Group, R8C/L36A Group, R8C/L38A Group, R8C/L3AA Group,

R8C/L35B Group, R8C/L36B Group, R8C/L38B Group, R8C/L3AB Group

RENESAS MCU

Overview

1.1

Features

The R8C/L35A Group, R8C/L36A Group, R8C/L38A Group, R8C/L3AA Group, R8C/L35B Group, R8C/L36B

Group, R8C/L38B Group, and R8C/L3AB Group of single-chip MCUs incorporate the R8C CPU core, which

implements a powerful instruction set for a high level of efficiency and supports a 1 Mbyte address space, allowing

execution of instructions at high speed. In addition, the CPU core integrates a multiplier for high-speed operation

processing.

Power consumption is low, and the supported operating modes allow additional power control. These MCUs are

designed to maximize EMI/EMS performance.

Integration of many peripheral functions, including multifunction timer and serial interface, helps reduce the

number of system components.

The R8C/L35A Group, R8C/L36A Group, R8C/L38A Group, and R8C/L3AA Group have data flash (1 KB × 4

blocks) with the background operation (BGO) function.

1.1.1

Applications

Household appliances, office equipment, audio equipment, consumer products, etc.

REJ03B0243-0030

Rev.0.30

Jan 21, 2009

PRELIMINARY

Notice: This is not a final specification.

Some parametric limits are subject to change.

R8CL3AB Datenblatt(PDF) 3 Page - Renesas Technology Corp