MPC5604B datasheet(39/106 Pages) FREESCALE

Teilenummer	MPC5604B

Bauteilbeschribung	32-bit MCU family built on the Power Architecture for automotive

PDF	106 Pages

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Hersteller	FREESCALE [Freescale Semiconductor, Inc]

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Electrical characteristics

MPC5604B/C Microcontroller Data Sheet, Rev. 8

Freescale Semiconductor



Junction-to-case thermal

characterization parameter,

natural convection

Single-layer board - 1s

TBD

°C/W

100

144

Four-layer board - 2s2p

TBD

100

144

1 Thermal characteristics are based on simulation.

2 V

DD = 3.3 V ± 10% / 5.0 V ± 10%, TA = -40 to 125 °C

3 Junction-to-ambient thermal resistance determined per JEDEC JESD51-3 and JESD51-6. Thermal test

board meets JEDEC specification for this package.

4 Junction-to-board thermal resistance determined per JEDEC JESD51-8. Thermal test board meets JEDEC

specification for the specified package.

5 Junction-to-case at the top of the package determined using MIL-STD 883 Method 1012.1. The cold plate

temperature is used for the case temperature. Reported value includes the thermal resistance of the interface

layer.

Table 10. LQFP thermal characteristics1 (continued)

Symbol

Parameter

Conditions2

Pin count

Value

Unit

MPC5604B Datenblatt(PDF) 39 Page - Freescale Semiconductor, Inc