MPL015A2

Sensors

Freescale Semiconductor

5

Pressure

Solder Recommendations

1.

Use SAC solder alloy (i.e., Sn-Ag-Cu) with a melting point of about 217°C. It is recommended to use SAC305

(i.e., Sn-3.0 wt.% Ag-0.5 wt.% Cu).

2.

Reflow

• Ramp up rate: 2 to 3 C/s.

• Preheat flat (soak): 110 to 130s.

• Reflow peak temperature: 250°C to 260°C (depends on exact SAC alloy composition).

• Time above 217°C: 40 to 90s (depends on board type, thermal mass of the board/quantities in the reflow).

• Ramp down: 5 to 6 C/s.

• Using an inert reflow environment (with O2 level about 5 to 15 ppm).

NOTE: The stress level and signal offset of the device also depends on the board type, board core material, board thickness

and metal finishing of the board.

Handling Recommendations

It is recommended to handle the MPL015A2 pressure sensor with a vacuum pick and place tool. Sharp objects utilized to move

the MPL015A2 pressure sensor increase the possibility of damage via a foreign object/tool into the small exposed port.

The sensor die is sensitive to light exposure. Direct light exposure through the port hole can lead to varied accuracy of pressure

measurement. Avoid such exposure to the port during normal operation.