MSC8152SVT1000B datasheet(64/68 Pages) FREESCALE

64 / 68 page

MSC8152 Dual-Core Digital Signal Processor Data Sheet, Rev. 1

Ordering Information

Freescale Semiconductor

3.6

Guide to Selecting Connections for Remote Power Supply

Sensing

To assure consistency of input power levels, some applications use a practice of connecting the remote sense signal input of an

on-board power supply to one of power supply pins of the IC device. The advantage of using this connection is the ability to

compensate for the slow components of the IR drop caused by resistive supply current path from on-board power supply to the

pins layer on the package. However, because of specific device requirements, not every ball connection can be selected as the

remote sense pin. Some of these pins must be connected to the appropriate power supply or ground to ensure correct device

functionality. Some connections supply critical power to a specific high usage area of the IC die; using such a connection as a

non-supply pin could impact necessary supply current during high current events. The following balls can be used as the board

supply remote sense output without degrading the power and ground supply quality:

•

VDD: W10, T19

•

VSS: J18, Y10

•

M3VDD: None

Do not use any other connections for remote sensing. Use of any other connections for this purpose can result in application and

device failure.

Ordering Information

Consult a Freescale Semiconductor sales office or authorized distributor to determine product availability and place an order.

Part

Package Type

Spheres

Core

Voltage

Operating

Temperature

Core

Frequency

(MHz)

Order Number

MSC8152

Flip Chip Plastic Ball Grid Array (FC-PBGA)

Lead-free

1.0 V

0° C to 105°C

1000

MSC8152SVT1000B

–40° to 105°C

1000

MSC8152TVT1000B

MSC8152SVT1000B Datenblatt(PDF) 64 Page - Freescale Semiconductor, Inc

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