| Datenblatt-Suchmaschine für elektronische Bauteile |
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H30R1202 Datenblatt(PDF) 2 Page - Infineon Technologies AG |
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H30R1202 Datenblatt(HTML) 2 Page - Infineon Technologies AG |
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2 / 12 page ![]() IHW30N120R2 Soft Switching Series Power Semiconductors 2 Rev. 1.5 Dec. 09 Thermal Resistance Parameter Symbol Conditions Max. Value Unit Characteristic IGBT thermal resistance, junction – case R th JC 0.38 Diode thermal resistance, junction – case R th JC D 0.37 Thermal resistance, junction – ambient R th JA 40 K/W Electrical Characteristic, at Tj = 25 °C, unless otherwise specified Value Parameter Symbol Conditions min. Typ. max. Unit Static Characteristic Collector-emitter breakdown voltage V (BR )C ES V GE=0V, IC =1mA 1200 - - Collector-emitter saturation voltage V CE(sat ) V GE = 15V, IC = 30A T j=25° C T j=125° C T j=175° C - - - 1.65 1.85 2.0 1.8 - - Diode forward voltage V F V GE=0V, I F=30A T j=25° C T j=125° C T j=175° C - - - 1.55 1.7 1.75 1.8 - - Gate-emitter threshold voltage V GE(th ) I C =0. 7mA, V CE= VGE 5.1 5.8 6.4 V Zero gate voltage collector current I CES V CE= 1200V, V GE=0V T j=25° C T j=175° C - - - - 5 2500 µA Gate-emitter leakage current I GES V CE=0V ,V GE =20V - - 100 nA Transconductance g fs V CE= 20V, IC= 30A - 19.7 - S Integrated gate resistor R Gin t none Ω |
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