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DMN601DMK Datenblatt(PDF) 1 Page - Diodes Incorporated

Teilenummer DMN601DMK
Bauteilbeschribung  DUAL N-CHANNEL ENHANCEMENT MODE FIELD EFFECT TRANSISTOR
PDF  4 Pages
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Hersteller  DIODES [Diodes Incorporated]
Direct Link  http://www.diodes.com
Logo DIODES - Diodes Incorporated

DMN601DMK Datenblatt(HTML) 1 Page - Diodes Incorporated

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DMN601DMK
Document number: DS30657 Rev. 4 - 2
1 of 4
www.diodes.com
December 2007
© Diodes Incorporated
DMN601DMK
DUAL N-CHANNEL ENHANCEMENT MODE FIELD EFFECT TRANSISTOR
Features
•
Dual N-Channel MOSFET
•
Low On-Resistance
•
Low Gate Threshold Voltage
•
Low Input Capacitance
•
Fast Switching Speed
•
Low Input/Output Leakage
•
Ultra-Small Surface Mount Package
•
Lead Free By Design/RoHS Compliant (Note 2)
•
ESD Protected Up To 2kV
•
"Green" Device (Note 4)
Mechanical Data
•
Case: SOT-26
•
Case Material: Molded Plastic, “Green” Molding
Compound. UL Flammability Classification Rating 94V-0
•
Moisture Sensitivity: Level 1 per J-STD-020C
•
Terminal Connections: See Diagram
•
Terminals: Finish
⎯ Matte Tin annealed over Copper
leadframe. Solderable per MIL-STD-202, Method 208
•
Marking Information: See Page 3
•
Ordering Information: See Page 3
•
Weight: 0.015 grams (approximate)
SOT-26
TOP VIEW
Internal Schematic
TOP VIEW
Source
Body
Diode
Gate
Protection
Diode
Gate
Drain
S
1
D
1
D
2
S
2
G
1
G
2
ESD protected up to 2kV
Equivalent Circuit Per Element
Maximum Ratings @TA = 25°C unless otherwise specified
Characteristic
Symbol
Value
Units
VDSS
60
V
Drain-Source Voltage
Gate-Source Voltage
VGSS
±20
V
Continuous
Pulsed (Note 3)
ID
305
800
mA
Drain Current (Note 1)
Thermal Characteristics @TA = 25°C unless otherwise specified
Characteristic
Symbol
Value
Units
Pd
225
mW
Total Power Dissipation (Note 1)
RθJA
556
°C/W
Thermal Resistance, Junction to Ambient
Tj, TSTG
-65 to +150
°C
Operating and Storage Temperature Range
Electrical Characteristics @TA = 25°C unless otherwise specified
Characteristic
Symbol
Min
Typ
Max
Unit
Test Condition
OFF CHARACTERISTICS (Note 5)
Drain-Source Breakdown Voltage
BVDSS
60
⎯
⎯
V
VGS = 0V, ID = 10μA
Zero Gate Voltage Drain Current
IDSS
⎯
⎯
1
μA
VDS = 60V, VGS = 0V
Gate-Source Leakage
IGSS
⎯
⎯
±10
μA
VGS = ±20V, VDS = 0V
ON CHARACTERISTICS (Note 5)
Gate Threshold Voltage
VGS(th)
1.0
1.6
2.5
V
VDS = 10V, ID = 1mA
VGS = 10V, ID = 200mA
Static Drain-Source On-Resistance
RDS (ON)
⎯
⎯
⎯
2.4
4.0
Ω
VGS = 4V, ID = 200mA
Forward Transfer Admittance
|Yfs|
100
⎯
⎯
ms
VDS =10V, ID = 200mA
Diode Forward Voltage (Note 5)
VSD
0.5
⎯
1.4
V
VGS = 0V, IS = 115mA
DYNAMIC CHARACTERISTICS
Input Capacitance
Ciss
⎯
⎯
50
pF
Output Capacitance
Coss
⎯
⎯
25
pF
Reverse Transfer Capacitance
Crss
⎯
⎯
5.0
pF
VDS = 25V, VGS = 0V
f = 1.0MHz
Notes:
1. Device mounted on FR-4 PCB.
2. No purposefully added lead.
3. Pulse width
≤10μS, Duty Cycle ≤1%.
4. Diodes Inc.’s “Green” policy can be found on our website at http://www.diodes.com/products/lead_free/index.php.
5. Short duration pulse test used to minimize self-heating effect.
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