AD8231ACPZ-R7 datasheet(7/24 Pages) AD

7 / 24 page

AD8231

Rev. A | Page 7 of 24

ABSOLUTE MAXIMUM RATINGS

THERMAL RESISTANCE

Table 4.

Parameter

Rating

Table 5.

Supply Voltage

6 V

Thermal Pad

Unit

Output Short-Circuit Current

Indefinite1

Soldered to Board

°C/W

Input Voltage (Common-Mode)

−VS − 0.3 V to +VS + 0.3 V

Not Soldered to Board

°C/W

Differential Input Voltage

−VS − 0.3 V to +VS + 0.3 V

The θ values in Table 5

Storage Temperature Range

–65°C to +150°C

assume a 4-layer JEDEC standard

board. If the thermal pad is soldered to the board, it is

also assumed it is connected to a plane. θ

Operational Temperature Range

–40°C to +125°C

Package Glass Transition Temperature

130°C

at the exposed pad

is 6.3°C/W.

ESD (Human Body Model)

1.5 kV

MAXIMUM POWER DISSIPATION

ESD (Charged Device Model)

1.5 kV

ESD (Machine Model)

0.2 kV

The maximum safe power dissipation for the AD8231 is limited

by the associated rise in junction temperature (T

1 For junction temperatures between 105°C and 130°C, short-circuit operation

beyond 1000 hours can impact part reliability.

) on the die. At

approximately 130°C, which is the glass transition temperature,

the plastic changes its properties. Even temporarily exceeding

this temperature limit may change the stresses that the package

exerts on the die, permanently shifting the parametric perform-

ance of the amplifiers. Exceeding a temperature of 130°C for an

extended period can result in a loss of functionality.

Stresses above those listed under Absolute Maximum Ratings

may cause permanent damage to the device. This is a stress

rating only; functional operation of the device at these or any

other conditions above those indicated in the operational

section of this specification is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect

device reliability.

ESD CAUTION

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