ADF5000

Rev. 0 | Page 9 of 12

OUTLINE DIMENSIONS

3.10

3.00 SQ

2.90

0.30

0.25

0.18

1.60

1.50 SQ

1.40

1

0.50

BSC

BOTTOM VIEW

TOP VIEW

16

5

8

9

12

13

4

EXPOSED

PAD

PIN 1

INDICATOR

0.45

0.40

0.35

SEATING

PLANE

0.05 MAX

0.02 NOM

0.20 REF

0.25 MIN

COPLANARITY

0.08

PIN 1

INDICATOR

FOR PROPER CONNECTION OF

THE EXPOSED PAD, REFER TO

THE PIN CONFIGURATION AND

FUNCTION DESCRIPTIONS

SECTION OF THIS DATA SHEET.

0.80

0.75

0.70

COMPLIANT TO JEDEC STANDARDS MO-220-WEED-6.

Figure 11. 16-Lead Lead Frame Chip Scale Package [LFCSP_WQ]

3 mm × 3 mm Body, Very Very Thin Quad

(CP-16-18)

Dimensions shown in millimeters

ORDERING GUIDE

Model1

Temperature Range

Package Description

Package Option

ADF5000BCPZ

−40°C to +105°C

16-Lead Lead Frame Chip Scale Package (LFCSP_WQ)

CP-16-18

ADF5000BCPZ-RL7

−40°C to +105°C

16-Lead Lead Frame Chip Scale Package (LFCSP_WQ), 7”Tape & Reel

CP-16-18

EVAL-ADF5000EB2Z

Evaluation Board