LC86P7148

No.6692-9/21

1. Absolute Maximum Ratings at Ta=25

°C, VSS=VSS1=VSS2=VSS3=0V

Ratings

Parameter

Symbol

Pins

Conditions

VDD[V]

min.

typ.

max.

unit

Supply voltage

VDDMAX

VDD1, VDD2

VDD3

VDD1=VDD2=

VDD3

-0.3

+7.0

LCD display

voltage

VLCD

V1/PL6, V2/PL5

V3/PL4

VDD1=VDD2=

VDD3

-0.3

VDD

Input voltage

VI

•Ports 71, 72, 73

•Port 8, Port L

-0.3

VDD+0.3

Input/output

voltage

VIO

•Ports 0, 1

•Port 9

•Ports A, B, C, D

-0.3

VDD+0.3

V

IOPH(1)

Ports 0, 1

-4

IOPH(2)

Ports A, B, C, D

-4

Peak

output

current

IOPH(3)

Port 9

•CMOS output

•At each pins

-4

ΣIOAH(1)

Ports 0, 1

Total all pins

-30

ΣIOAH(2)

Ports A, B

Total all pins

-20

ΣIOAH(3)

Ports C, D

Total all pins

-20

High

level

output

current

Total

output

current

ΣIOAH(4)

Port 9

Total all pins

-20

IOPL(1)

Ports 0, 1

At each pins

20

IOPL(2)

Ports A, B, C, D

At each pins

20

IOPL(3)

Port 9

At each pins

20

Peak

output

current

IOPL(4)

Port 70

At each pins

15

ΣIOAL(1)

Ports 0, 1

Total all pins

40

ΣIOAL(2)

Ports A, B

Total all pins

24

ΣIOAL(3)

Ports C, D

Total all pins

24

ΣIOAL(4)

Port 9

Total all pins

15

Low

level

output

current

Total

output

current

ΣIOAL(5)

Port 70

Total all pins

10

mA

Maximum power

dissipation

Pdmax

QFP80E

Ta=-30 to+70°C

515

mW

Operating

temperature

range

Topr

-30

+70

Storage

temperature

range

Tstg

-65

+150

°C

Notes •The QFP packages should be heat-soaked for 12 hours at 125

°C immediately prior to mounting (This baking is called

pre-baking).

•After pre-baking a controlled environment must be maintained until soldering.

The environment must be held at a

temperature of 30

°C or less and a humidity level of 70% or less. Please solder within 24 hours.