PCF210AA datasheet(2/63 Pages) NXP

2 / 63 page

PCF2123

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Product data sheet

Rev. 5 — 27 April 2011

2 of 63

NXP Semiconductors

PCF2123

SPI Real time clock/calendar

Ordering information

[1]

Unsawn wafer.

[2]

Sawn 6 inch wafer on Film Frame Carrier (FFC) for 6 inch wafer, see Figure 37 on page 53.

[3]

Sawn 6 inch wafer with gold bumps on Film Frame Carrier (FFC) for 8 inch wafer, see Figure 38 on page 53.

Marking

Table 1.

Ordering information

Type number

Package

Name

Description

Version

PCF2123BS/1

HVQFN16

plastic thermal enhanced very thin quad flat package;

no leads; 16 terminals; body 3

× 3 × 0.85 mm

SOT758-1

PCF2123TS/1

TSSOP14

plastic thin shrink small outline package; 14 leads;

body width 4.4 mm

SOT402-1

PCF2123U/5GA/1

wire bond die

12 bonding pads[1]

PCF2123U/10

PCF2123U/10AA/1

wire bond die

12 bonding pads[2]

PCF2123U/10

PCF2123U/12AA/1

WLCSP12

wafer level chip size package; 12 bumps[3]

PCF2123U/12

PCF2123U/12HA/1

WLCSP12

wafer level chip size package; 12 bumps[3]

PCF2123U/12

Table 2.

Marking codes

Type number

Marking code

PCF2123BS/1

123

PCF2123TS/1

PCF2123

PCF2123U/5GA/1

PC2123-1

PCF2123U/10AA/1

PC2123-1

PCF2123U/12AA/1

PC2123-1

PCF2123U/12HA/1

PC2123-1

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